MiJing KC8 Motherboard Chip Glue Removal Blades Set

Description

MiJing KC8 Motherboard Glue Removal Blade Set – Multi-Function IC & CPU Rework Knife with 8 Interchangeable Blades

The MiJing KC8 Glue Removal Blade Set is a professional-grade toolset designed specifically for precise glue removal and CPU/IC disassembly on mobile phone motherboards. Whether you’re cutting through black glue, removing side adhesive, or prying up hard disks, the KC8 delivers versatility, strength, and unmatched precision.

Crafted from high-carbon elastic steel and enhanced with a vacuum-plated, hand-polished finish, each blade offers excellent wear resistance, heat resistance, and corrosion protection. The ergonomic handle and quick blade release system allow for a seamless repair experience, even during long sessions.

🔧 Key Features:
🔄 Quick-Release Rebound Mechanism: Effortlessly swap blades mid-task for uninterrupted workflow.
🔪 8 Precision Blades Included: Covers a wide range of applications from black glue cutting to hard disk prying.
💪 High-Carbon Elastic Steel Construction: Offers excellent toughness and flexibility without deformation.
🔥 Heat & Corrosion Resistant: Withstands high temperatures and resists wear for long-lasting performance.
🧰 Hand-Finished Quality: Each blade is hand-polished and vacuum plated for enhanced durability and consistency.
✋ Comfortable Ergonomic Handle: Designed for a secure, fatigue-free grip during detailed work.
📐 Laser-Cut Uniformity: Precision-crafted blades ensure consistent performance across every repair task.
📦 Package Includes:
1 × Ergonomic Handle
8 × Interchangeable Blades
Ideal for smartphone motherboard repairs, IC glue removal, and rework tasks, the MiJing KC8 sets a new standard in precision repair tools for professionals who demand efficiency, durability, and comfort.